? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 08/20/13 description features applications the sp3003 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each i/o pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at the maximum level specifed in the iec 61000-4-2 international standard (level 4, 8kv contact discharge) without performance degradation. their very low loading capacitance also makes them ideal for protecting high speed signal pins such as hdmi, dvi, usb2.0, and ieee 1394. ? esd protection of 8kv contact discharge, 15kv air discharge, (iec61000-4-2) ? eft protection, iec61000-4-4, 40a (5/50ns) ? lightning protection, iec61000-4-5, 2.5a (8/20s) ? low capacitance of 0.65pf (typ) per i/o ? low leakage current of 0.5a (max) at 5v ? complete line of small packaging helps save board space (sc70, sot553, sot563, msop10, dfn-6l ) ? aec-q101 qualifed (dfn package) ? lcd/ pdp tvs ? dvd players ? desktops ? mp3/ pmp ? digital cameras ? set top boxes ? mobile phones ? notebooks ? computer peripherals pinout nc v cc i/o 1 gnd i/o 2 i/o 4 v cc i/o 3 i/o 1 gnd i/o 2 sp3003-04x/j sp3003-02x/j functional block diagram sp30 03-04j/xtg sp30 03-04a tg sp30 03-02j/xtg sp30 03-08a tg 1 2 3 6 5 4 1 2 3 4 5 10 9 8 7 6 1 2 3 1 2 3 4 5 10 9 8 7 6 5 4 i/o 1 i/o 2 v nc gnd cc nc nc nc i/o 3 i/o 4 sp30 03-04a i/o 1 i/o 2 nc i/o 3 i/o 4 sp30 03-08a gnd i/o 8 i/o 7 i/o 6 i/o 5 life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example ic *p ack age is shown as tr ansparent dvi/ hdmi po rt vc c/nc vc c/nc signal gnd gnd gnd d2+ gnd gnd gnd gnd d2- d1+ d1- d0+ d0- clk+ clk - a single, 4 channel sp3003-04 device can be used to protect four (4) of the data lines in a hdmi/dvi interface so two (2) sp3003-04 devices provide protection for all eight (8) tmds lines. sp3003-02utg (aec-q101 qualifed) sp3003-02utg sp3003 series 0.65pf diode array additional information datasheet samples resources tvs diode arrays (spa ? diodes) low capacitance esd protection - sp3003 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 08/20/13 caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 2.5 a t op operating temperature C40 to 125 c t stor storage temperature C55 to 150 c thermal information parameter rating units storage temperature range C55 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 20-40s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6 v reverse leakage current i leak v r =5v 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 10.0 12.0 v i pp =2a, t p =8/20s, fwd 11. 8 15.0 v esd withstand voltage 1 v esd iec61000-4-2 (contact) 8 kv iec61000-4-2 (air) 15 kv diode capacitance 1 c i/o-gnd reverse bias=0v 0.7 0.8 0.95 pf reverse bias=1.65v 0.55 0.65 0.8 pf diode capacitance 1 c i/o-i/o reverse bias=0v 0.35 pf note: 1. parameter is guaranteed by design and/or device characterization. capacitance vs. bias voltage insertion loss (s21) i/o to gnd -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 fr equency [hz] inser tion loss [db] 1.00 0.95 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 i/o capacitance (pf) i/o dc bias (v) v cc = 3.3v v cc = float v cc = 5v tvs diode arrays (spa ? diodes) low capacitance esd protection - sp3003 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 08/20/13 capacitance vs. frequency 0 2e-1 3 4e-1 3 6e-1 3 8e-1 3 1e-1 2 1 .2e-1 2 1 .4e-1 2 1 .e+06 1 .e+07 1 .e+08 1 .e+09 fr equency [hz] capacitance [f] product characteristics lead plating matte tin (sc70-x, msop-10) pre-plated frame (sot5x3, dfn-6) lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) substitute material silicon body material molded epoxy flammability ul 94 v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. package surface matte fnish vdi 11-13. ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters tvs diode arrays (spa ? diodes) low capacitance esd protection - sp3003 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 08/20/13 package dimensions sc70-6 d a2 a a1 c l e he 2 1 3 6 5 4 e e b package sc70-6 pins 6 jedec mo-203 millimeters inches min max min max a 0.80 1. 10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1. 0 0 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1. 15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 recommended solder pad layout package dimensions sc70-5 d a2 a a1 c l e he 2 1 3 6 5 not used 4 e e b package sc70-5 pins 5 jedec mo-203 millimeters inches min max min max a 0.80 1. 10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1. 0 0 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1. 15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 recommended solder pad layout package dimensions sot553 package sot 553 pins 5 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1. 10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 c he l a d 6 4 2 3 e e b 5 (not used) recommended solder pad layout tvs diode arrays (spa ? diodes) low capacitance esd protection - sp3003 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 08/20/13 package dimensions sot563 package sot 563 pins 6 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1. 10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 c he l a d 6 4 2 3 e e b 5 recommended solder pad layout package dimensions msop10 recommanded solder p ad layout package dimensions dfn-6l package dfn-6l jedec mo-229 pins 6 millimeters inches min max min max a 0.45 0.55 0.018 0.022 a1 0.00 0.05 0.000 0.002 a3 0.125ref 0.005ref b 0.35 0.45 0.014 0.018 b1 0.15 0.25 0.006 0.010 d 1.55 1.65 0.062 0.065 d2 - - - - e 0.95 1.05 0.038 0.042 e2 - - - - e 0.50ref 0.020ref l 0.33 0.43 0.013 0.017 recommended solder pad layout recommended solder pad layout package msop10 jedec mo-187 pins 10 millimeters inches min max min max a - 1. 10 - 0.043 a1 0.00 0.15 0.000 0.006 b 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 d 2.90 3.10 0.114 0.122 e 4.67 5.10 0.184 0.200 e1 2.90 3.10 0.114 0.122 e 0.50 bsc 0.020 bsc he 0.40 0.80 0.016 0.031 tvs diode arrays (spa ? diodes) low capacitance esd protection - sp3003 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 08/20/13 embossed carrier tape & reel speci f cation msop-10 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 5.40 5.60 0.213 0.220 d 1.50 1.60 0.059 0.063 d1 1.50 min 0.059 min p0 3.90 4.10 0.154 0.161 10p0 40.0 0.20 1.5740.008 w 11.90 12.10 0.469 0.476 p 7.90 8.10 0.311 0.319 a0 5.20 5.40 0.205 0.213 b0 3.20 3.40 0.126 0.134 k0 1.20 1.40 0.047 0.055 t 0.30 0.05 0.012 0.002 user f eeding direc tion pin 1 l ocation embossed carrier tape & reel speci f cations sot553 and sot563 millimetres inches min max min max e 1.65 1.85 0.064 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.076 0.081 d 1.40 1.60 0.055 0.063 d1 0.45 0.55 0.017 0.021 p0 3.90 4.10 0.154 0.161 10p0 40.0 0.20 1.5740.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 1.73 1.83 0.068 0.072 b0 1.73 1.83 0.068 0.072 k0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max user f eeding direc tion pin 1 l ocation embossed carrier tape & reel speci f cations sc70-5 and sc70-6 millimetres inches min max min max e 1.65 1.85 0.064 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 1. 0 0 1.25 0.039 0.049 p0 3.90 4.10 0.154 0.161 10p0 40.0 0.20 1.5740.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.14 2.34 0.084 0.092 b0 2.24 2.44 0.088 0.960 k0 1. 12 1.32 0.044 0.052 t 0.27 max 0.010 max user f eeding direc tion pin 1 l ocation tvs diode arrays (spa ? diodes) low capacitance esd protection - sp3003 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 08/20/13 part numbering system sp 3003 -0x x t g series number of channels -02 = 2 channel (sc70-5, sot553, dfn-6l packages) -04 = 4 channel (sc70-6, sot563, msop-10 packages) -08 = 8 channel (msop-10 packages) package a = msop-10, 4000 quantity j = sc70-5 or sc70-6, 3000 quantity x = sot553 or sot563, 5000 quantity u= dfn-6l, 3000 quantity t= tape & reel g= green tvs diode arrays (spa ? diodes) part marking system f * * f * * product serie s f=sp3003 series assembl y site (varies) number of channels (varies) ordering information part number package marking min. order qty. sp3003-02jtg sc70-5 f * 2 3000 sp3003-02utg dfn-6l fh2 3000 SP3003-02XTG sot553 f * 2 3000 sp3003-04atg msop-10 f * 4 4000 sp3003-04jtg sc70-6 f * 4 3000 sp3003-04xtg sot563 f * 4 3000 sp3003-08atg msop-10 f * 8 4000 embossed carrier tape & reel speci f cation dfn-6l millimetres inches min max min max e 1.65 1.85 0.064 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.076 0.081 d 1.40 1.60 0.055 0.063 d1 0.45 0.55 0.017 0.021 p0 3.90 4.10 0.154 0.161 10p0 40.00.20 1.5740.008 w 7.90 8.30 0.311 0.319 p0 3.90 4.10 0.154 0.161 a0 1. 15 1.25 0.045 0.049 b0 1.75 1.85 0.069 0.073 k0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max tvs diode arrays (spa ? diodes) low capacitance esd protection - sp3003 series
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